W75Cu25 tungsten copper alloy rod
Key words:
Classification:
Rods
- 产品描述
-
- Commodity name: W75Cu25 tungsten copper alloy rod
WCu alloy material owns the excellence of tungsten and copper, high-temperature-resistant, electro-arc resistant, with high intensity and high proportion. It is also good at transmitting electric and heat, and easy to be processed, so it is widely used for machinery, electric power, electric metallurgy, aviation, space flight.
What's Copper Tungsten Alloy?
Tungsten copper alloy (Copper Tungsten Alloy, CuW, or WCu) is a pseudo-alloy of copper and tungsten. As copper and tungsten arenot mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The Copper Tungsten Alloy combines the properties of both copper and tungsten, resulting in a material that is heat-resistant,ablation-resistant, high thermal and electrical conductivity, and easy to machine. Parts are made from the WCu alloy by pressing the tungsten particles into a desired shape, sintering the compacted part, then infiltrating with molten copper. Sheets, rods and bars of the alloy are available as well.
The manufacturing processes of tungsten copper alloy round rod are static pressure molding, high temperature sintering, soluble copper infiltration. Tungsten Copper Alloy Rods Specification:1. Diameter: 0.9-100.0mm2. Length: 2.0-300mm3. Density: 11.85-16.75 g/cm34. Composition: W content: 50-90%, Cu content: 10-50%5. Surface: Sintered surface, Forged surface, Ground surface
The main application of tungsten copper alloy is as below:
a. High performance material for aerospace industry.
b. Vacuum contact materials
c. Electrode for electrical discharge machining
d. Electronic packaging materials and heat sink material
Features:
1. High hardness, high density, High strength, high heat resistant;
2. Excellent thermal and electrical conductivity;
3. Better arc burning loss resistance, erosion resistance;
4. Easy to be machined.Grade
Chemical Composition %
Mechanical properties
Cu
Impurity
W
Density(g/cm3)
HardnessHB
RES( cm)
ConductivityIACS/ %
TRS/ Mpa
W50Cu50
50+2.0
0.5
Balance
11.85
115
3.2
54
---
W55Cu45
45+2.0
0.5
Balance
12.3
125
3.5
49
---
W60Cu40
40+2.0
0.5
Balance
12.75
140
3.7
47
---
W65Cu35
35+2.0
0.5
Balance
13.3
155
3.9
44
---
W70Cu30
30+2.0
0.5
Balance
13.8
175
4.1
42
790
W75Cu25
25+2.0
0.5
Balance
14.5
195
4.5
38
885
W80Cu20
20+2.0
0.5
Balance
15.15
220
5
34
980
W85Cu15
15+2.0
0.5
Balance
15.9
240
5.7
30
1080
W90Cu10
10+2.0
0.5
Balance
16.75
260
6.5
27
1160
Previous Page
Next Page
Previous Page
Next Page
Product inquiry
Note: Please leave your contact information and our professionals will contact you as soon as possible!
Contact Person: Teresa
Address: Building 2, Dahan Hewlett-Packard Industrial Park, Tianyuan District, Zhuzhou City, Hunan Province China
Concerned about the public.